Qianli Middle Layer Tin Planting Platform For iPhone 14 / 14 Plus / 14Pro / 14Pro Max (4in1)
Features:
- Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 14/14 Plus/14Pro/14Pro Max (4-in-1)
- To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
- Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
- CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
- Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
- High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature
- Avoiding SIM card base not being tinned while the motherboard is tinned
- Imported selection of high-quality steel material, manufacture under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
- Square chamfer mesh, prevent the tin balls from being stuck in the mesh
User's Guide Shows:
- Put the lower layer of the motherboard that needs reballing to the corresponding positioning pins
- Place it in the synthetic stone base, install the SIM card baffle
- Align the stencils of the corresponding model with the positioning pins and put it into the base
- Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste
- Combine the top cover of the product with the base and operate, use the hot air gun to heat the corresponding reballing hole
Package Content*
1x Reballing Platform
1x Stencil
