Qianli Middle Layer Tin Planting Platform For iPhone 13 / 13 Pro / 13 Pro Max / 13 Mini (4in1)

Features:

• Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs
• Silicone non-slip foot pads, a specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid, and anti-scald so that the tin planting position is more stable
• Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini

Using:

• Install the motherboard. Put the lower layer of the motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base
• Align the stencils of the corresponding model with the positioning pins and put them into the base
• Apply the solder paste at the corresponding temperature to the rebelling hole, and make sure that each hole is covered with solder paste
• Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole

Package Content*

1x 4-in-1 Middle frame reballing platform