Hong Hai Tong No. 5 IC Glue Removal Blade (Curve)

Hong Hai Tong No. 5 IC Glue Removal Blade (Curve)

Features:

• Premium IC Glue Removal Tool: Designed for mobile phone repair technicians to assist in removing adhesive and glue around IC components.
• Bent Blade Design: The bent blade shape helps provide better access to hard-to-reach areas during precision repair work.
• Precision Cleaning: Suitable for carefully scraping residual glue and adhesive from PCB surfaces during repair and rework.
• Mobile Phone PCB Repair: Ideal for technicians working on smartphone motherboards and electronic circuit boards.
• IC Rework Assistance: Useful for cleaning adhesive around IC chips during component removal, replacement, and motherboard repair.
• Compact & Easy to Handle: Designed for detailed repair tasks that require controlled blade movement.
• Professional Repair Tool: Suitable for mobile phone repair shops, electronics technicians, and motherboard repair specialists.
• Versatile Repair Applications: Can be used for precision adhesive removal in compatible electronic repair applications.

Package Content*

1x Hong Hai Tong 5 No. IC Glue Removal Blade - (Bent)