Mechanic Heat Air Intelligent Motherboard Layered Desoldering Station
Features:
- Cellphone motherboard repair intelligent delamination station, one key intelligent separation/bonding function, safe and reliable, will not cause tin explosion phenomenon
- In just 60 seconds, the heating platform heats up quickly, in 180 seconds, it can easily complete layered tasks
- The intelligent temperature control system and high-temperature protection function ensure that the motherboard will not be damaged during operation to provide users with a safe and efficient heating experience
- The heating platform uses efficient heating elements and heat-conduction materials, ensuring rapid heating up in just 1 minute, with its 600W peak power input
- The heating platform features a 2.5-inch HD display that clearly shows the real-time temperature, countdown, and three temperature memory storage to keep you on top of the heating status, easily respond to various work demands
- Multifunction key stepless dial, multifunctional stepless dial rotary key, and multiple function definition settings make it easy with one click
- Temperature setting(Room temperature ~260°C): Rotate the button to adjust the temperature, click to switch the memory temperature, long press to heat up, and long press again to cool down
- Time setting(10 sec~990 sec): Double-click to enter the time setting, adjust the setting time through the knob double-click again, or wait 5-8 seconds to confirm
- Heat is generated during the working process and this heat needs to be dissipated through the heat dissipation hole
- Using maintenance technology, the blocking defect of a maintenance operation is further optimized, built for the motherboard, high temperature, and no blocking, making maintenance work more convenient
- Adopting an aluminum alloy and steel high-quality combination, not only the appearance is beautiful and generous, but it also has high hardness and excellent corrosion resistance
- The heating platform is designed for the full series of iPhone X-15 models, to ensure better compatibility with various models, more modules continue to develop
- Boot current fault data storage, current curve fault analysis can be checked, supports Bluetooth /WiFi wireless connection to PC applications, support remote cloud software upgrade
Package Content*
1x Host
1x Common Module
1 x Power Cable
