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-29 %
Out Of Stock
Brand: Ma Ant
Model: 2629
Ma Ant SL-1 IC Chip Heating Platform for DegummingFeatures:One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal workThis applies to 99%of the chips on the market, 20mm x 18.5mm working area, supports multip..
Rs.999 Rs.1,400
-27 %
Out Of Stock
Brand: Ma Ant
Model: 2630
Ma Ant SL-2 IC Chip Heating Platform for Degumming (Upgraded)Features:2-generation upgrade rapid temperature removal table, one-button heating, rapid heating, the temperature can be adjusted 160~250℃, support multi-generation Apple, Huawei chip glue removal, tin removal workThis applies to 99%of the..
Rs.1,099 Rs.1,500
-15 %
Brand: Mechanic
Model: 2710
Mechanic iDrive Multifunction Electric OCA Glue Remover With Screwdriver SetFeatures:Loaded with imported bearings, stable transmission, speed 0-1600 RPM, 20dB low noise rotation, work without worryMotor forward and reverse design, meet various requirements of glue removal, low speed rotation, do no..
Rs.2,500 Rs.2,950
-19 %
Brand: Mechanic
Model: 2497
Mechanic IR16 Mobile Phone Screen OCA Glue Cutting / Grinding All-in-one Electric RemoverFeatures:One-piece glue remover, infinitely variable speed, can adjust the speed at will, the same core does not jitter, removable battery, plug and playBi-directional rotation, flexible response to a variety of..
Rs.850 Rs.1,050
-19 %
Out Of Stock
Brand: Mechanic
Model: 2318
Mechanic OCA Glue Remover Multi Function Machine - IR13 Description:MECHANIC iR13 OCA glue removal tool, OCA glue cleaning grinding cutting tools for phone repair, mobile phone mutli-functional rechargeable head glue removal tool, degumming, cutting, polish, drug free water, hands free tear, in..
Rs.850 Rs.1,050
Out Of Stock
Brand: Mechanic
Model: 1733
InstructionsApplicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile ..
Rs.370
Brand: Relife
Model: 1641
InstructionsApplicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile ..
Rs.450
-34 %
Out Of Stock
Model: 2149
Product Overview:Non-slipUltra-thin-bucklenon-blocking knifeProduct Details:Adjust the distance of the double nozzles freely to be left and rightAccurate card slot, minimum distance up to 1mm, maximum distance up to 22mmNon-slip design at the bottomBGA Size 1.5-20MMPacking Content*1x TE-186 Uni..
Rs.1,199 Rs.1,825
-29 %
Out Of Stock
Model: 2401
TE-187 Universal Mini IC Chip Repair Fixture Great Stability: The maintenance fixture is resistant to high temperature, corrosion resistance, could dissipate heat quickly.Easy Cleaning: The IC chip maintenance fixture is easy to clean, more convenient to remove glue and tin.Firmly Clamping: The..
Rs.599 Rs.840
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