Mechanic C9+ Heating Platform IC Glue RemoverProducts Details:Rapid Temperature RiseLead-free constant temperatureUniversal 936/210/T12 Series Desolde..
You can add points to your accounts with this and you can buy anything from our website later on using these reward points. You can add multiple quant..
Features:- Function: The soldering flux paste improves efficiency of the soldering process.- Usage: Effectively makes solder form strong, long lasting..
Iron 908 With Heat Controller (60W) With Free 5 BitsThis soldering iron hand tool is used in soldering electrical components and supplies heat to melt..
Ma Ant SL-1 IC Chip Heating Platform for DegummingFeatures:One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal workThis applies to 99%of the chips on the market, 20mm x 18.5mm working area, supports multip..
Ma Ant SL-2 IC Chip Heating Platform for Degumming (Upgraded)Features:2-generation upgrade rapid temperature removal table, one-button heating, rapid heating, the temperature can be adjusted 160~250℃, support multi-generation Apple, Huawei chip glue removal, tin removal workThis applies to 99%of the..
Mechanic IR16 Mobile Phone Screen OCA Glue Cutting / Grinding All-in-one Electric RemoverFeatures:One-piece glue remover, infinitely variable speed, can adjust the speed at will, the same core does not jitter, removable battery, plug and playBi-directional rotation, flexible response to a variety of..
Mechanic OCA Glue Remover Multi Function Machine - IR13 Description:MECHANIC iR13 OCA glue removal tool, OCA glue cleaning grinding cutting tools for phone repair, mobile phone mutli-functional rechargeable head glue removal tool, degumming, cutting, polish, drug free water, hands free tear, in..
InstructionsApplicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile ..
InstructionsApplicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile ..
Product Overview:Non-slipUltra-thin-bucklenon-blocking knifeProduct Details:Adjust the distance of the double nozzles freely to be left and rightAccurate card slot, minimum distance up to 1mm, maximum distance up to 22mmNon-slip design at the bottomBGA Size 1.5-20MMPacking Content*1x TE-186 Uni..
TE-187 Universal Mini IC Chip Repair Fixture Great Stability: The maintenance fixture is resistant to high temperature, corrosion resistance, could dissipate heat quickly.Easy Cleaning: The IC chip maintenance fixture is easy to clean, more convenient to remove glue and tin.Firmly Clamping: The..