Features:1. Provide ultimate protection against oxidation for the copper traces of a PCB or BGA2. Effectively prevent solder bridges from forming between closely spaced solder pads3. Also essential during the repairing of printed circuit boards4. Made of high-grade material, safe and reliable5. Fill..
Features:1. Provide ultimate protection against oxidation for the copper traces of a PCB or BGA2. Effectively prevent solder bridges from forming between closely spaced solder pads3. Also essential during the repairing of printed circuit boards4. Made of high-grade material, safe and reliable5. Fill..
Features:1. Provide ultimate protection against oxidation for the copper traces of a PCB or BGA2. Effectively prevent solder bridges from forming between closely spaced solder pads3. Also essential during the repairing of printed circuit boards4. Made of high-grade material, safe and reliable5. Fill..